ausgewählte Veröffentlichungen

• Abschnitt eines Buches

  • Realization of Double-Sided Wiring Boards of Biopolymer 2020

• Artikel

  • Handle Hot Molded Parts reproducibly Automation in Elastomer Production.  Kautschuk und Gummi, Kunststoffe, Vol.75(3), pp. 16-20.  2022
  • Increase the Degree of Freedom Improve the Productivity of Rubber Injection Molding.  Kautschuk und Gummi, Kunststoffe, Vol.75(3), pp. 28-28.  2022
  • Mit neuen Injektoren Pulverlacke und andere Stäube problemlos fördern 2010
  • Insecticidal Effects of Different Application Techniqies for Silica Dusts in Plant Protection on Phaedon cochleariae Fab. and Pieris brassicae L. 2010
  • Evaluating solder paste behaviours through reological test methods and their correlation to the printing performance 2010
  • Matrix influence on the OLED emitter Ir(btp)(2)(acac) in polymeric host materials - Studies by persistent spectral hole burning.  Organic electronics, Vol.9(5), pp. 641-648.  2008
  • Plant protection with silica particles: Electrostatic application and impact of particle layer density on the insecticidal efficacy.  Gesunde Pflanzen, Vol.60(1), pp. 29-34.  2008
  • Electrical and stability properties and ultrasonic microscope characterisation of low temperature co-fired ceramics resistors.  Microelectronics and reliability, Vol.41(5), pp. 669-676.  2001
  • Optimization of thermal distribution in ceramics and LTCC structures applied to sensor elements.  Microelectronics international, Vol.15(2), pp. 34-38.  1998
  • Monofunctional DNA-platinum(II) adducts block frequently DNA polymerases.  Nucleic acids research, Vol.20(9), pp. 2307-2312.  1992
  • Applicability of Different Bio-based Polymers for Wiring Boards.  Periodica polytechnica. Electrical engineering and computer science, Vol.63(1), pp. 1-8. 

• Dokument

  • Nachhaltige Verdrahtungsträgerkonzeptionen mit umweltverträglichem geomimetischem Flammschutz 2013
  • Applikation der Elektronenstrahltechnologie in der Verbindungstechnik
  • Substrates based on renewable resources for printed circuit boards
  • Wandlungsfähiges Beschichtungssystem für feine pulverförmige Medien

• Konferenz-Poster

  • Additivation Effects on Properties of Polylactic Acid Compounds 2017
  • Vergleichende Untersuchungen von Aushärtetechnologien für die Polymer-Dickschichttechnik 2011
  • Korrosionsschutz mit High-Solid-Beschichtungen unter extremen Beanspruchungen (Lausitzer Seen)

• Patent

  • Verfahren zur Quantifizierung von Polymerspezies in einer Polymerpartikel enthaltenden Probe

• Tagungsband

  • Process Design of the Component Mix of 01005 and Land Grid Array on a PCB.  2021 44th International Spring Seminar on Electronics Technology (ISSE), pp. 1-6. 2021
  • Usability of Bio-based Polymers for PCB.  2019 42nd International Spring Seminar on Electronics Technology (ISSE), Vol.2019-, pp. 1-7. 2019
  • Comparison of Different Bio-based Polymers for Electronic Substrates.  2018 41st International Spring Seminar on Electronics Technology (ISSE), Vol.2018-, pp. 1-6. 2018
  • Influences of SMD sample preparation and examination conditions on shear test results.  2017 40th International Spring Seminar on Electronics Technology (ISSE), pp. 1-5. 2017
  • Materials made of renewable resources in electrical engineering.  2017 40th International Spring Seminar on Electronics Technology (ISSE), pp. 1-5. 2017
  • Investigation of wiring boards based on biopolymer substrates.  2016 39th International Spring Seminar on Electronics Technology (ISSE), Vol.2016-, pp. 77-82. 2016
  • Effect of incorporation of different additives in sustainable polymers on selected electrical and mechanical properties.  2015 38th International Spring Seminar on Electronics Technology (ISSE), Vol.2015-, pp. 21-25. 2015
  • Electron beam curing of pastes for the polymer thick film (PTF) technology.  Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE), pp. 45-49. 2011
  • The design concept of system integration based on heterostructure.  Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE), pp. 17-21. 2011
  • Rheological Characterisation of New Lead-Free Solder Paste Formulations for Flip-Chip Assembly.  2006 1st Electronic Systemintegration Technology Conference, Vol.2, pp. 995-1000. 2006
  • Properties and utilization of 3D bent-multilayer hybrid structures.  27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004, Vol.2, pp. 291-295 vol.2. 2004