Überblick

Open Access

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Peer Reviewed

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Abstract

• This paper deals with the production of PLA wiring substrates. Firstly, the heat distortion temperature of PLA is improved at higher temperatures by an annealing process. Double-sided PLA wiring carriers were realized by means of through-hole plating. For this purpose, the suitability of PLA in the electroplating process is investigated and the quality of the realized through-holes was tested. The electroplated PLA substrate was structured and assembled with components and its shear strength was tested.

authors

• Gunther Göbel
• Anna Schmid
• Bauer, Reinhard
• Carolin Henning
• Cindy Rueckmar
• Harre, Kathrin
• Philipp Zink

Veröffentlichungszeitpunkt

• Januar 1, 2020

veröffentlicht in

• 2020 43RD INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), Vol.2020-, pp. 1-6  Zeitschrift